A few days ago, a phone got listed on TENAA as C106 revealing some of the specifications of the handset. Today, the Chinese smartphone making company LeEco has made an official announcement about a smartphone which will be released with the collaboration of LeEco and CoolPad, and the specifications of this upcoming smartphone indicate that this device has been listed as C106 on the TENAA listing recently.
LeEco has recently bought a major stake in CoolPad and LeEco-CoolPad has revealed the handset, which is being called the Cool1, on their official Weibo handle. From the name we get the hint the smartphone is the product of the collaboration between the two companies, and the main USP of this device, the Dual rear camera lens, has also being flaunted in the name itself.
Though LeEco-CoolPad has not officially spilled the bean about the Cool1 features and specifications, last week an image of the handset was leaked on the internet, and the photo suggests that the Cool1 will sport a Dual-lens camera and the Fingerprint sensor on the back panel of the handset. Moreover, the recent rumors and speculations also suggest that Cool1 will feature a 5.5-inch display with 2K resolution, as well as will be powered a Snapdragon 820 processor coupled with 4GB of RAM.
As per the Cool1 specifications, it looks like this is going to be the first flagship device from this jointly collaborated company. Meanwhile, more leaked information indicates that Cool1 will offer its buyers 64GB of internal storage and will run on CoolPad’s CoolUI and LeEco’s EUI, two Android 6.0 Marshmallow based Operating Systems. The buyers can choose either of the one variants. Also, this flagship device will house a 3500mAh battery and like we have mentioned above, a fingerprint sensor on the back side.
The detailed information on Cool1 price and other specifications like camera are still unknown, but as both the companies have history to price their devices aggressively, we hope the handset will be priced very competitively. The Cool1 will be officially unveiled in China on 10th August.
