Another day, another Samsung news. The latest reports suggest that the South Korean tech conglomerate will begin the mass production phase of the Samsung Galaxy S9 and its bigger sibling, the Galaxy S9+, in the first month of 2018. The parts that are used to build these devices have already started arriving. The market shelves will receive these devices in March if the reports are accurate.
Days ago, we had reported that the Galaxy S9 duo would be arriving early next year. Samsung is likely to announce the devices by February following which the launch will take place.
GizmoChina reports that the company has already started receiving the stacked circuit boards that are called SLP (an acronym for Substrate Like PCB). These are essentially the building blocks of these phones. This is a type of system board design on which the larger components are held together tightly so that the bigger components, like the battery, are attached with space to spare. This sort of motherboard design is also, incidentally, used by the closest rival of this upcoming device, the Apple iPhone X.
A total of five different suppliers are filling orders for the SLP with a sixth supplier set to join them in February. This means two important things. One is that Samsung is eager to produce major quantities of the devices and in record time. The other is that these devices may possibly have bigger batteries when compared to the existing devices. In fact, yesterday, we had reported how some dazzling new cases of the devices had been leaked to the world.
The mass production of the camera module has also begun in earnest as the report points out. The Samsung Galaxy S9 will have a single rear camera, as we have already reported earlier. The front panel will have an iris scanning and picture taking camera, in a rare combination. The Galaxy S9+ devices will have dual rear cams, the first Galaxy S series devices to have these.
